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DOWSIL TC-2030 Thermally Conductive Adhesive

DOWSIL TC-2030 Thermally Conductive Adhesive是一种双组分,灰色,1比1混合比,热固化导热粘合剂,适用于粘合电气/电子部件和电路板,以确保有效的热管理。

DOWSIL TC-2030 Thermally Conductive Adhesive是一种双组分,灰色,1比1混合比,热固化导热粘合剂,适用于粘合电气/电子部件和电路板,以确保有效的热管理。

Two-part, gray, 1 to 1 mix ratio, heat cure thermally conductive adhesive, suitable for bonding electrical/electronic components and boards to ensure effective heat management.


用途

DOWSIL TC-2030粘合剂适用于粘合电气元件和电路板,并提供有效的热传递

DOWSIL TC-2030 Adhesive is suitable for bonding electrical components and boards and providing efficient thermal transfer


优势

High thermal conductivity

Good adhesion to Cu and Al substrates

Heat dissaption from critical components

Mechanical stability

Provides electrical insulation


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